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IPC APEX Expo , being held April 10-14th in Las Vegas, Nevada, features advanced and emerging technologies in printed board design and manufacturing, electronics assembly and test. Discover solutions to your most vexing production challenges. Meet experts and build your industry network.
Chip-On-Board Technology brings unique assembly options to the systems designer. In this technology the silicon die is glued directly to the surface of a printed circuit board between the die and the PCB or AL2O3 to establish the electric connection; a coating of opaque epoxy resin is deposited over the die to protect it against shocks and the harmful effects of light. Features/Benefits: High or Low Voltage Design Custom Coatings Multi-layer, Double-sided Boards Functional Board Testing High or Low Volume Wide Temperature Ranges Cost Competitive Solutions Turn-Key Applications
