Network implementation consists of the following steps: I.Physical network design 1. Local Area Network design LAN design consists of selecting appropriate devices such as Hubs, Bridges, Switches, and Routers. Criteria for selecting LAN devices include the following: The number of ports required at different levels The speed (10Mbps/100Mbps/1Gbps or others) Media considerations, such as Ethernet, Token Ring etc. 2. Various WAN technologies are available for connecting enterprise resources.
Leased lines Synchronous Optical Network (SONET) Frame Relay Asynchronous Transfer Mode (ATM) The technology that suit an enterprise requirement depends on the bandwidth and QoS requirements, security requirements, and application requirements. II. The companies are increasing becoming mobile. III. Appropriate test methods be developed for thoroughly testing a campus or enterprise network. Network planning consists of the following steps: 1.
Identifying the applications that you intend to use: Computer networking may be required diverse environments such as Enterprise Resource Management (ERM), Internet telephony, Instant Messaging (IM), eMail and others.These in turn are used for estimating the software, hardware, and traffic requirements. 2. Traffic Requirements: Computing traffic requirements include several factors. Identification and documentation of major traffic sources. 3. 4. 5. 6. A list of network services that will be provided such as FTP, Web, e-mail, etc. 7. Improve efficiency on WAN circuits by using features such as compression, Voice Activity Detection etc. Cert-Ex™ Exam Simulator for ITF+ Download. * 30% Off Special Discount Offer Available.
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We use cookies to enhance your experience. 4 Solders, fluxes, and solderability. Solders, Fluxes, And Solderability : Solder Alloys And Applications 4 Solders, fluxes, and solderability 1. Solder Alloys and applications The alloy of tin and lead is the one mainly used and other alloys are considered to fulfill any specific requirements as given earlier. The main constituents of the solder alloy are 60% tin and 40% lead, but they also often contain amounts of other relatively low melting metals such as bismuth, indium, and silver. The extensive use of the Tin / Lead alloy is due the following reasons. 1. SMTManufacturing Classification Methods : Type Ia, Ib Assembly. SMTManufacturing Classification Methods : Type Ia, Ib Assembly 3 Manufacturing 1. Classification of manufacturing methods: Use of SMT along with that of through-hole components give rise to different assembly methods.
Here we have used the term primary side/ component side interchangeably and this represents the side where conventional through-hole components are placed. The term secondary side/ solder side are used interchangeably and this represents the side which gets soldered when using through-hole components alone. Assembly methods can be broadly classified into 2 groups as given below: 1. 2. 1. Type IB assembly: Type IB consists of surface mount components on either side of the PCB and as expected the functional density is very high. Secondary/ trace side Primary/ component side. SMTComponents Shipment Methods & Component Procurement Guidelines. SMTComponents Shipment Methods & Component Procurement Guidelines 3. Component shipping methods Prominent component shipping methods are tape and reel, tube, and tray form.
Components are also available in bulk if required. But the bulk components are generally used only for very limited, simple components such as resistors and capacitors. ‘Tape and reel’ form is used for all surface mount components such as resistors, capacitors, diodes, SOTs, SOICs, PLCCs, SOJs etc. Various packaging styles are shown below. SOT-23: Line Diagram 4. Component procurement specifications are important for any surface mount component as the technology is in transition stage. . - deal with a limited number of vendors, establishing specs in cooperation with the preferred vendors.
. - Only limited number of packages that enjoy widespread support should be selected for use. . - Surface mount standards, even when they exist, are not supposed to be used as procurement specifications. SMTBenifits & Commonly Used Components Package. SMTBenifits & Commonly Used Components Package 2 Introduction to SMT 1. Benefits of SMT - reduction in package size resulting in greater functionality in the same board area - reduction in weight. . - reduction in noise, this is primarily due to smaller electrical paths compared to leaded components.
-higher operating speed resulting from shorter interconnect distances 2. Surface mount components are functionally no different from leaded components. The surface mount components also see much higher temperatures during soldering. SMCs may be broadly divided into passive and active components. 2.1 Passive components: Ceramic capacitors, tantalum capacitors, thick film resistors form the core group of passive components. Resistors: There are two main types of surface mount resistors.: thick film and thin film. The resistive layer on the top surface dissipates the heat and should always face away from the substrate surface. Chip Resisitor: Line Diagram A sample of actual chip resistor.
A+ Essentials Certification Notes. Exam Cram Details For CompTIA® A+™ Core 1 & A+™ Core 2 Certification. Satellite Phone : Introduction, Functions, Manufacturers, Features. Nano Technology. CCNP ENARSI certification prepration notes. CCNP ENARSI Certification Cram Notes The CCNP ENARSI (Implementing Cisco Enterprise Advanced Routing and Services) exam tests a candidate's knowledge and skills related to implementing advanced routing technologies and services in enterprise networks. The exam objectives are as follows: 1.0 Layer 3 Technologies 1.1 Troubleshoot administrative distance (all routing protocols) Administrative distance (AD) is a measure of the trustworthiness of a routing information source.
It is used by routers to determine which route to use when there are multiple paths to a destination network that have been learned from different sources. Important steps to troubleshoot AD issues in all routing protocols: 1. 2. 3. 4. 5. 6. By following these troubleshooting steps, you can identify and resolve AD issues in all routing protocols. What is subnetting in IPv4? Give an example. What is zone transfer in DNS?
What is WDM? What is virtual IP? Some of the important TCP/IP protocols and port numbers used. What are sub interfaces. What is IPv6 SLAAC? What is SIP? What are secure protocols? What is Reverse DNS/reverse lookup? What is a punch down tool? Explain it's working. What is Punchdown block? What is a Patch panel/patch bay? What is NTP? What is link local address in IPv6? What are IPv6 router advertisements? What is IPv6 dual stack? What are different packet types in IPv4? What addressing types are available in IPv6? Contrast with IPv4. What are root DNS servers? Explain DNS record types. Explain DNS Recursive lookup vs. Iterative lookup. What is DNS Caching? What is DNS? What is DHCP? What are IPv4 address classes? Fiber Optic Patch Panel/ Distribution panel. Explain fiber ethernet standards. What is CWDM? Explain Copper based Ethernet standards.
What is CIDR? What is the CAT 8 cable? What is a CAT cable? Explain different types of CAT cables. Distinguish between 100 Base TX vs. 100 Base T. LearnSoftMax - Future Enhancements. LearnSoftMax - Communication and Collaboration. LearnSoftMax - Reporting and Analytics. LearnSoftMax - Course Management. LearnSoftMax - Assessment and Testing. LearnSoftMax - Student Enrollment.
LearnSoftMax- Content Delivery. LearnSoftMax - Course creation and delivery. Cert-Ex Practice Tests for A+ Core 1. Networkplus Cram Notes : Networking Fundamentals. 1.0 Network+ Certification Cram Notes : Networking Fundamentals Contents 1.0 Networking Fundamentals 1.1 Open Systems Interconnection (OSI) model layers and encapsulation concepts. OSI model, explain with examples 1. The OSI (Open Systems Interconnection) model is a seven-layer model that provides a standardized framework for understanding and describing the different components involved in transmitting data over a network.
Each layer in the OSI model is responsible for a specific set of functions and communicates with the layer above and below it using well-defined protocols. 1. 2. 3. 4. 5. 6. 7. By understanding the different functions of each layer in the OSI model, network administrators and engineers can better understand the interactions between the different components of a network and diagnose problems more effectively. Routing Fundamentals for Cisco CCNA.
Routing Fundamentals for Cisco CCNA The following topics have been covered in this article. Please note that all the technologies discussed in the article may not be relevant to CCNA or CCNP. It is given for overall understanding of the subject matter. 1. There are several different types of routing technologies that are commonly used in networks. 1. 2. Some examples of DV protocols: 2.1. 2.2. 2.3. These protocols are less popular and less used in modern networks, but are still implemented in some networks for specific use cases. 3. Tutorials On SMT, Networking, Satellite Communication, Software & Other Art.