Memory. ARM reveals Eagle core as Cortex-A15, capable of quad-core computing at up to 2.5GHz. Virtualization. Steve Leibson » LPDDR2. Processor Selector - ARM. Rosing. Network on Chip (NoC) Interconnect Technology for System on Chip (SoC) With the need to integrate an increasing variety of Semiconductor Intellectual Property (IP) blocks in a single System on Chip (SoC), communication management becomes critical when highly diversified functions with varying latency and bandwidth requirements must be supported in an interconnect fabric. NoC technology is often called “a front-end solution to a back-end problem.” As semiconductor transistor dimensions shrink and increasing amounts of IP block functions are added to a chip, the physical infrastructure that carries data on the chip and guarantees quality of service begins to crumble. Many of today's systems-on-chip are too complex to utilize a traditional hierarchal bus or crossbar interconnect approach.
Yesterday's village traffic has turned into today's congested freeways. Here are four reasons why today's SoC's need a NoC IP interconnect fabric: Reduce Wire Routing Congestion Ease Timing Closure Higher Operating Frequencies Change IP Easily. Home | MIPI Alliance. Snapdragon (processor) Qualcomm Snapdragon Logo Snapdragon is a family of mobile systems on a chip (SoC) by Qualcomm. Qualcomm considers Snapdragon a "platform" for use in smartphones, tablets, and smartbook devices. The majority of Snapdragon processors contain the circuitry to decode high-definition video (HD) resolution at 720p or 1080p depending on the Snapdragon chipset.[3] Adreno, the company's proprietary GPU technology, integrated into Snapdragon chipsets (and certain other Qualcomm chipsets) is Qualcomm's own design, using assets the company acquired from AMD.[4] The Adreno 225 GPU in Snapdragon S4 SoCs adds support for DirectX 9/Shader Model 3.0 which makes it compatible with Microsoft's Windows 8.[5] The Snapdragon 410[204] system on a chip was announced on the 9 December 2013, it is Qualcomm's first 64-bit mobile system on a chip.
It also has Multimode 4G LTE, Bluetooth, Wi-Fi, NFC, GPS, GLONASS and BeiDou capabilities, and contains the Adreno 306 GPU. Hardware HEVC/H.265 decode acceleration[232] Symmetric multiprocessing. Diagram of a symmetric multiprocessing system Symmetric multiprocessing (SMP) involves a multiprocessor computer hardware and software architecture where two or more identical processors connect to a single, shared main memory, have full access to all I/O devices, and are controlled by a single OS instance that treats all processors equally, reserving none for special purposes. Most multiprocessor systems today use an SMP architecture.
In the case of multi-core processors, the SMP architecture applies to the cores, treating them as separate processors. SMP systems are tightly coupled multiprocessor systems with a pool of homogeneous processors running independently, each processor executing different programs and working on different data and with capability of sharing common resources (memory, I/O device, interrupt system and so on) and connected using a system bus or a crossbar. Design[edit] Processors may be interconnected using buses, crossbar switches or on-chip mesh networks. CPU cache. Overviews[edit] When the processor needs to read from or write to a location in main memory, it first checks whether a copy of that data is in the cache. If so, the processor immediately reads from or writes to the cache, which is much faster than reading from or writing to main memory. Most modern desktop and server CPUs have at least three independent caches: an instruction cache to speed up executable instruction fetch, a data cache to speed up data fetch and store, and a translation lookaside buffer (TLB) used to speed up virtual-to-physical address translation for both executable instructions and data.
The data cache is usually organized as a hierarchy of more cache levels (L1, L2, etc.; see Multi-level caches). Cache entries[edit] Data is transferred between memory and cache in blocks of fixed size, called cache lines. When the processor needs to read or write a location in main memory, it first checks for a corresponding entry in the cache. Cache performance[edit] CPU stalls[edit] The Smartbook Blog | PROCESS, PACKAGING HELP TAME A SNAPDRAGON. How Qualcomm Navigates the Waters of 3D IC Commericalization | 3D InCites. A Qualcomm Perspective on 3D ICs - Industry Insights - Cadence Community. 3D integration is a promising new technology that can potentially save space and power by stacking die in 3 dimensions. I recently spoke with Riko Radojcic, Qualcomm design lead for TSS (Through Silicon Stacking – Qualcomm’s term for 3D ICs), about how Qualcomm is deploying this technology and developing a design environment that can support it.
Radojcic was on his way to Nice, France, where he’s presenting a talk on 3D integration and through-silicon vias (TSVs) at an April 24 workshop at the DATE Conference. Why is Qualcomm interested in this technology? Radojcic said TSS can provide form factors that save board space and power. TSS can also support heterogenous integration with its ability to place digital logic, analog, RF, and memory on different die. Qualcomm is currently developing its first implementation of what it calls a “stage one” class of TSS products. Radojcic said that Qualcomm describes the design approach for stage 1 as “2.5D” rather than “3D.”
Richard Goering. Gallery - Qualcomm New York Analyst Day - November 2010 - 38 Photos - AnandTech :: Your Source for Hardware Analysis and News#38.