Conductive & Resistive Inks | Methode. American Dye Source, Inc. - Providing Innovative Materials to the World. Allied PhotoChemical - Sustainable UV - Ultraviolet Light-curable inks, coatings and paints. High resolution printed circuits formed in photopolymer pattern indentations overlaying printed wiring board substrates - Patent # 4645733. This invention relates to printed circuits and more particularly it relates to high density, high conductivity, high reliability printed wiring over substrates with surface irregularities. Many problems of conductivity and reliability are posed in circuit patterns which are more dense and more closely packed together.
For example, low resolution screen printing and etching methods provide edge smears which tend to short togetheradajcent wires, thus limiting spacing between conductors to more than about 0.01 inch (0.025 cm). Also, the conventional methods of plating or depositing printed wires, which usually are thinner than 0.001 inch (0.003 cm), results in very lowconductivity wiring when the conductor widths are less than about 0.006 inch (0.015 cm).
Even more restrictive in practical low cost systems is the nature of the substrates. Attempts have been made to photographically reproduce high resolution printed wiring patterns as shown by U.S. Pat. No. 2,585,700 to S. In the drawings: Conductive SU8-silver composite photopolymer. Conductive SU8-silver composite photopolymer. A new electrically conductive photosensitive composite resist has been formulated and used to build microcomponents. This composite material is based on the SU-8 photopolymer, an insulating negative-tone photoresist, in which silver nano-particles have been dispersed to enhance the electrical properties of the polymer. The properties of this new photosensitive composite have been characterized by optical and electrical measurements. The patterned composite structures can be obtained for a wide range of values of the electrical conductivity, by varying the powder volume fraction of the composite.
The lateral resolution of the produced structures were evaluated, and depending on the patterning conditions, can be better than 5 mum. Keywords: epoxy-resin ; percolation ; behavior ; threshold Reference.