Plate-forme R&D Micro-PackS. Micro-PackS est une plateforme R&D, créée en 2006 dans le cadre de l’opération CIMPACA, avec le soutien des collectivités territoriales (CR PACA, CG13, CPA) et de l’Europe, en faveur de l’innovation et au bénéfice notamment des PME. Juridiquement, c’est une association "loi 1901" qui régit une mutualisation de ressources matérielles (équipements scientifiques et pré-industriels) entre ses membres. Micro-PackS s’est logiquement intégré au pôle de compétitivité mondial SCS en tant que plateforme d’innovation au service de l’éco-système des « objets communicants sécurisés » dans cinq spécialités : i) le micro-packaging, ii) l’électronique imprimée, iii) les caractérisations physiques et électriques des assemblages, iv) la caractérisation sécuritaire, v) la pré-certification RF.
Micro-PackS est principalement implanté au sein du Site Georges Charpak de Gardanne (salles blanches, laboratoires de fiabilité et de sécurité), avec une antenne satellite à l’ISEN de Toulon (pré-certification RF).
The Blame Game. Revue des materiaux avances. Revue des Composites et des Matériaux Avancés Photo-oxydation/hy. Photo-oxydation/hydrolyse de matrices époxy. Effets de la photo-oxydation sur les propriétés mécaniques Deux types de vieillissement ont été mis en oeuvre : artificiel dans une cellule HERAEUS SUNTEST® CPS (photo-oxydation) et naturel selon la norme d'inclinaison et d'orientation NF T51165 (photo-oxydation et hydrolyse). Le processus physico-chimique de photo-oxydation a été révélé en mesurant l'ablation de la surface irradiée. Après une période transitoire, la perte d'épaisseur des matrices varie linéairement avec l'énergie d'insolation globale cumulée.
Cela est dû à l'évolution en régime permanent d'une couche photo-oxydée d'épaisseur constante qui, une fois instaurée, avance spatialement dans la matrice saine au même rythme que le recul de la surface irradiée. L'évolution des propriétés mécaniques de la couche de dégradation a été suivie en mesurant le module d'Young et la dureté à l'aide d'un Nano-Indenteur (Nano-Instrument® ), en fonction de la profondeur. Français. HC electronics - design, component purchasing, PCB assembly, tes. Chemistry - few periodic rules to rule them all :)
International. Spheron™ WLCSP – Bump on I/O and Spheron™ WLCSP – Redistribution FlipChip’s Flagship Spheron™ WLCSP technology utilizes a proprietary dielectric material, which offers improved electrical performance and reliability over other polymer repassivation options. In addition to its advanced dielectric material, the Spheron WLCSP™ product family incorporates a growing number of subtractive sputtering and semi-additive electroplated Cu based metallization options targeting specific customer needs. For example, some of the Spheron WLCSP product breadth over the past few years has been developed in response to the evolving board level requirements of portable handheld products.
Spheron WLCSPs use pre-formed solder spheres of 200μm to 500μm in diameter to routinely bump device pitches ranging from 0.35 to 0.8 mm pitch and reflowed for final bump heights of 160μm to 400μm. Spheron WLP™ Redistribution – Standard Process Flow Electroplated Cu Spheron™ WLCSP – Redistribution UltraCSP® Process Summary. CSP - Chip Scale Package. Chip Scale Package (CSP) Chip Scale Package, or CSP, based on IPC/JEDEC J-STD-012 definition, is a single-die, direct surface mountable package with an area of no more than 1.2 X the original die area. The acronym 'CSP' used to stand for 'Chip Size Package,' but very few packages are in fact the size of the chip, hence the wider definition released by IPC/JEDEC.
The IPC/JEDEC definition likewise doesn't define how a chip scale package is to be constructed, so any package that meets the surface mountability and dimensional requirements of the definition is a CSP, regardless of structure. For this reason, CSP's come in many forms - flip-chip, non-flip-chip, wire-bonded, ball grid array, leaded, etc. Because of this variety of chip scale packages developed in the industry, one can not make any generalized assumptions on the manufacturability or reliability of the CSP as a homogeneous package group. Figure 1. How Xilinx and Philips used a pencil (left) and a cell phone Figure 2. Figure 3. CSP - Chip Scale Package. SERMA TECHNOLOGIES.
LE GUICHET UNIQUE DE LA MICROELECTRONIQUE EUROPEENNE. SOCIETÉ: RoodMicrotec. La société de Test et Laboratoire d’expertise RoodMicrotec est une société indépendante certifiée dans le domaine du test et de l’expertise pour des applications propres à l’industrie micro et optoélectroniques. Du fait de notre large gamme de prestations, nous sommes le partenaire idéal au niveau européen à pouvoir vous proposer une alternative à la résolution de vos problèmes de test et d’expertise.
Notre Service s’articulant autour du wafer, des boîtiers d’ICs, des modules, des cartes comme les techniques et procédés de montage, d’assemblage comme le soudage,le collage, le crimping regroupe les aspects ci-après: (eXtended) Supply Chain Services Engineering et Programmation Qualification Analyse de défaillances Test de l'appareil, la programmation de l'appareil, les services de fin deligne.
United Test and Assembly Center Ltd. Nos services et produits pour l'électronique et la microélectron. Swissbit COB - Chip-On-Board (COB) DRAM Products. Golden Altos Packages. Golden Altos is experienced in assembling a wide range of package types and sizes; from 8-pin DIPs to 559-pin PGAs and nearly everything in between. In most cases customers supply their own packages, but Golden Altos can also source packages through existing relationships with recognized package manufacturers.
Standard Ceramic Packages Ceramic SOIC — Small Outline Integrated Circuit CERDIP — Ceramic Dual Inline Package with lead frame Windowed or Non-Windowed CERPAC — Ceramic Package with unformed leads on two opposite sides CERQUAD — Ceramic Package with unformed leads on all four sides Windowed or Non-Windowed CQFP — Ceramic Quad Flat Pack with bottom leads on all four sides FLATPACK — Ceramic Package with bottom leads on two opposite sides JLCC — Leaded Chip Carrier with "J" bend leads LCC — Leadless Chip Carrier PGA — Pin Grid Array Cavity Up or Down With or Without Heatsinks SIDEBRAZE — Ceramic Dual Inline Package with attached leads Specialty Packages.
C-MAC MicroTechnology - High reliability microelectronic product. SA - Centre Suisse d'Electronique et de Microtechnique - Swiss C. Neuchâtel, 5 February 2009 - Silicon resonators offer significant advantages compared to quartz crystals for timing applications. Thinner and smaller than their quartz counterparts they are also more robust, and offer better aging performance, as well as programmability.
Furthermore they can benefit from the economies of scale of CMOS wafer processing to achieve lower cost, as well as the possibility of integration into a single monolithic structure with no external components. Silicon resonators however suffer from a strong temperature dependence; various methods are used to overcome this, however these methods tend to increase the complexity of the device or the system power consumption when relying on electronic temperature dependant fractional PLLs.
CSEM will present its results at the International Solid State Circuits Conference in San Francisco in February. Www.micro-devices.co.uk/index. DIY Electronics. Southern China is now the major centre for making chip-on-board (COB) electronics. And DIY Electronics is the only supplier that we know of that is supplying these items to the public in general & the hobbyist in particular. We have put together a range of these items. If you are interested to buy these or similar items in bulk then please email us with your requirements.
COB means that the very small die form of the IC is bonded directly onto a PCB and the copper tracks come out from it. A blob of black epoxy covers & protects it. The benefit is a saving in space. SG1 through 14 are COB Kits which give a sound of some sort. Assembled kit showing cob pcb inserted into the motherboard from the top and from underneath. SG1M - Three Train Sounds Whistle-blowing, chugging, level crossing bell and clackety clack of train crossing bridge. SG1M Documentation SG2M - Cellular Phone Sounds Scan of Motherboard Imitates real phone tones, engaged and ringing sounds, two door chimes. Scan of Motherboard. Siliconfareast CoB. Chip-on-Board (COB) Chip-on-Board, or COB, refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically interconnected to its final circuit board, instead of undergoing traditional assembly or packaging as an individual IC.
The elimination of conventional device packaging from COB assemblies simplifies the over-all process of designing and manufacturing the final product, as well as improves its performance as a result of the shorter interconnection paths. The general term for COB technology is actually 'direct chip attachment', or DCA. Aside from circuit boards used for COB's, various substrates are available for use in DCA. There are, for instance, ceramic and glass ceramic substrates which exhibit excellent dielectric and thermal properties.
The COB process consists of just three major steps: 1) die attach or die mount; 2) wirebonding; and 3) encapsulation of the die and wires. Figure 1. IC Manufacturing; Assembly Equipment. Electronic Contract Manufacturing Services Capabilities - Electr. AmTECH Microelectronics, Inc. | PCB Assembly and Advanced Packag. Advanced Packaging, IC Assembly (Cleanroom ISO 7) Microelectronics packaging technologies are in a state of transition. Product requirements are driving circuit designers to create smaller, faster and more reliable products. AmTECH has the talent, expertise and technology to meet the most demanding requirements for aluminum wedge, gold wedge and gold ball wire bonding for Chip-On-Board (COB), Chip-On-Flex (COF), IC Assembly and other Advanced Packaging technologies.
AmTECH quick-turn prototype standard delivery is 5-days with optional 1, 2 or 3 days. IC Assembly We offer quick-turn Prototype and low to medium volume Production for IC Assembly. Ceramic Package Assembly: DIP, CQFP, LCC, CPGA, C-SOIC Plastic Package Assembly: QFN, QFP, SOIC, SSOP Lid Attach or Encapsulation: taped-lids, ceramic lids, combo lids, plastic lids, glob top (black opaque) or transparent encapsulation materials. Chip-On-Board (COB) and Chip-On-Flex (COF) AmTECH’s Advanced Packaging, IC Assembly capabilities: